BGA prepracovať spájkovacie stanice LY-5860(C) dotykový displej BGA Prepracovať Stanice horúci vzduch 3 zóny pre Notebook Doske Čip Opravy

Štítky: bga prepracovať stanice ir6000, stanica zvaru, reflow stanice, acer notebooku doska, asus f200m, ir stanice, bga infračervené, bga spájkovacia stanica, bga prepracovať stanice, notebook oprava základnej dosky.

BGA rework machine LY- 5860 5860C touch screen BGA Rework Station hot air 3 zones for Laptop Motherboard Chip Repair

Specification:

Product name

BGA/SMD Reball Station

Voltage

AC220V±10% 50/60Hz

Power

4800W

Top heater

Hot air 800W

Bottom heater

Hot air 1200W, Infrared 2700W

Positioning

V groove, PCB support can be adjusted in X,Y direction and equipped with universal fixture

Temperature control

K sensor, closed loop control

Temp accuracy

±2°C

PCB size

Max 500x400mm, Min 22x22mm

minimum chip spacing

0.15mm

BGA chip

2*2-80*80mm

External Temperature Sensor

1(optional)

Machine dimension

64x71x60cm

N.W.

40KG

Main feature

1.three independent heating: top hot air heating, bottom hot air heating and IR preheating

2.HD touch screen

3.vacuum pen

4.good price bga rework station

5.LED light

Accessories

-1 piece user guide

-1 piece CD

-1 piece brush

-1 piece temperature sensor

- 5 pcs hot air nozzle: top nozzle 3pc(31x31mm,38x38mm,41x41mm), Bottom nozzle 2pcs (34x34mm,55x55mm)PS: Hot air nozzle size can be customized according to your chip size

-1 piece vacuum pen

-3 pcs vacuum sucker

-6 pcs universal fixture

-6 pcs plug knob

-4 pcs supporting screw

Main feature:

1.Adopt linear slide which makes X, Y, Z axis all can do micro adjust or rapid positioning, with high precision, easy operation.

2.High definition touch screen (Taiwan) , PCL control, can save multiple groups profile, password protection and modify function, equipped with instant temperature curve analysis function;

3.There are 3 independent heating areas.The 1st and 2nd are hot-air heaters, the 3rd is IR preheating.

4.Offer all kinds of hot-air nozzle, it can rotate 360°;With magnet, easy to install and change, customized is available;

5.K-type thermocouple (closed loop), heating independently, temperature precision within ± 3degree.

6.V-groove PCB support can be adjusted in any direction with external universal fixture, suitable for all kinds of BGA repair.

7.powerful cross-flow fan rapidly cool the PCB board to improve efficiency; Also built-in vacuum pump and external vacuum suction pen, pick up the chips rapidly.

8.After finishing desoldering & soldering, There is an alarming and alarming in advance.

9.CE certificate, with emergency stop and Automatic power off protection device when abnormal accident happens;with a double overheating protection control.